| 微电子封装中等离子体清洗及其应用 |
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| 引用本文： | 聂磊,蔡坚,贾松良,王水弟. 微电子封装中等离子体清洗及其应用[J]. 半导体技术, 2004, 29(12): 30-34 |
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| 作者姓名： | 聂磊 蔡坚 贾松良 王水弟 |
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| 作者单位： | 清华大学微电子学研究所,北京,100084;清华大学微电子学研究所,北京,100084;清华大学微电子学研究所,北京,100084;清华大学微电子学研究所,北京,100084 |
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| 摘 要： | 随着微电子工艺的发展,湿法清洗越来越局限,而干法清洗能够避免湿法清洗带来的环境污染,同时生产率也大大提高.等离子体清洗在干法清洗中优势明显,本文主要介绍了等离子体清洗的机理、类型、工艺特点以及在微电子封装工艺中的应用.
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| 关 键 词： | 等离子体清洗 干法清洗 微电子封装 |
| 文章编号： | 1003-353X(2002)12-0030-05 |
| 修稿时间： | 2004-10-29 |
Plasma Cleaning and Its Application in Microelectronics Packaging |
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| NIE Lei,CAI Jian,JIA Song-liang,WANG Shui-di. Plasma Cleaning and Its Application in Microelectronics Packaging[J]. Semiconductor Technology, 2004, 29(12): 30-34 |
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| Authors: | NIE Lei CAI Jian JIA Song-liang WANG Shui-di |
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| Abstract: | Wet cleaning process is getting more and more limitated in the development of themicroelectronic industry. Dry cleaning methods would be the solutions for the environment pollu-tion caused by wet cleaning. The productivity of dry cleaning is improved as well. Plasma cleaninghas more obvious advantages than other processes. The mechanism, types, process characteristicand the applications of plasma cleaning in microelectronics packaging are presented. |
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| Keywords: | plasma cleaning dry cleaning microelectronics packaging |
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