| 大尺寸硅片自旋转磨削运动分析及仿真 |
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| 引用本文： | 陈卓,魏昕,任庆磊,谢小柱. 大尺寸硅片自旋转磨削运动分析及仿真[J]. 金刚石与磨料磨具工程, 2009, 0(5): 1-6 |
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| 作者姓名： | 陈卓 魏昕 任庆磊 谢小柱 |
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| 作者单位： | 广东工业大学机电工程学院,广州,510006 |
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| 基金项目： | 国家自然科学基金项目(NO.U0734008);;广东省自然科学基金项目(8151009001000048) |
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| 摘 要： | 本文利用数学矩阵方法，建立大尺寸硅片自旋转磨削运动的理论模型，研究了砂轮半径、硅片和砂轮旋转速度、旋转方向等因素的选择及各因素对磨削轨迹的影响，同时还研究了磨粒合成运动速度的变化规律。研究结果表明，随着砂轮半径的增大，磨削轨迹的曲率减小，选用较小直径砂轮将更有利硅片表面质量的提高。当转速比i大于零，随着i值的增大，磨削轨迹的曲率逐渐减小。在转速比i小于零的情形，当转速比i=-2时，磨削轨迹曲率为0，磨削轨迹的形状接近一条直线。磨粒合成运动速度随砂轮转速和硅片转速的增大而增大。
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| 关 键 词： | 硅片自旋转磨削 磨削轨迹 磨粒合成运动速度 |
Analysis and simulation of grinding motion on large size wafer self-rotating grinding |
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| Chen ZhuoWei,XinRen,QingleiXie,Xiaozhu. Analysis and simulation of grinding motion on large size wafer self-rotating grinding[J]. Diamond & Abrasives Engineering, 2009, 0(5): 1-6 |
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| Authors: | Chen ZhuoWei XinRen QingleiXie Xiaozhu |
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| Affiliation: | Faculty of Electromechanical Engineering;Guangdong University of Technology;Guangzhou 510006;China |
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| Abstract: | By use of matrix method,the mathematical model of grinding marks on large size wafer self-rotating grinding is developed.With the developed model,the selection principles of the factors which include the radius of the diamond wheel,the rotating speed,the rotation direction of the silicon wafer and diamond wheel,and the relationships between grinding marks and those factors are discussed.The rules of resultant motion speed of abrasive grains are also studied.The results show that the curvature of the grindin... |
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| Keywords: | wafer self-rotating grinding grinding marks resultant motion speed |
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