Electrophoretic Deposition of Lead Zirconate Titanate Films on Metal Foils for Embedded Components

Lead zirconate titanate (PZT) thick films in the thickness range of 5–200 μm on 20 μm copper and 25 μm platinum foils were prepared by electrophoretic deposition (EPD) for application as embedded passive components. The EPD process was conducted in glacial acetic acid medium, and the effects of deposition parameters, such as dc voltage values, processing times, and suspension aging on the film thickness and composition stoichiometry were evaluated. The dependence of the film thickness on the current and aging of the suspension was established and correlated to the chemical modifications occurring in the suspension. Films sintered at 1150°C for 30 min exhibited uniform and dense microstructures with an average grain size of 1.5 μm. A dielectric permittivity of around ∼1330 and loss tangent of 0.05 were measured for films with 8 μm of thickness. The films showed remanent polarization and a maximum polarization value of 24 and 38 μC/cm², respectively. These properties, comparable with those of bulk PZT ceramics, suggested potential applications of the EPD process for the deposition of ferroelectric thick films on metal foils for embedded component applications.