Micro-ECM for production of microsystems with a high aspect ratio |
| |
Authors: | R Förster A Schoth W Menz |
| |
Affiliation: | (1) IMTEK- Department of Process Technology, University Freiburg Georges-Koehler-Allee 103, 79110 Freiburg, Germany |
| |
Abstract: | The most used processes for production of microsytem components are basically from the semiconductor technology. The material properties of used silicon often don t achieve the demands of for example: micro-surgery, biotechnology life science, fluidics or high temperature environment. For microstructuring of highly stressed metals, like stainless and heat resisting steels, cold work tool steels, hot work tool steels and nickel-base-alloys and a variety of metals there is no manufacturing-process. An interesting possibility for structuring this type of materials are the electrochemical machining processes (ECM). Some new developed ECM-sinking-processes are working with oscillating tool-electrode, to improve shape accuracy. |
| |
Keywords: | |
本文献已被 SpringerLink 等数据库收录! |
|