铰链式高冲击微加速度传感器封装的有限元模拟

给出了一种新型铰链式高冲击微加速度传感器实际封装结构的有限元模拟分析。首先分析了封装前铰链式加速度传感器的振型,然后分析了封装结构在无灌封和五种不同灌封材料下的前十阶模态频率特性。灌封胶弹性模量对封装后加速度传感器整体结构的振动模态有一定的影响,封装结构同一振型的模态频率随着灌封胶弹性模量的增大而增大,但是灌封胶弹性模量很小时(E≤1 GPa)会导致加速度传感器信号失真。模拟结果表明,可以选择弹性模量足够高的材料(E>9 GPa)作为高冲击加速度传感器的灌封材料。

Finite element simulation on packaging of hinged high-g micromachined accelerometer

A novel packaged hinged high-g micromachined accelerometer was studied by finite element simulations. The mode shape of high-g accelerometer without packaging were analyzed, and then the first ten natural frequency characteristics of packaging structure without and with different potting materials were discussed. Experimental results conclude that the elastic modulus of potting material has a significant influence on the mode shape of the accelerometer packaged. The mode frequency of the packaging structure increases with the elastic modulus of potting material, but the small elastic modulus (E≤1 GPa) will bring a strong distortion of the accelerometer output. The simulation results also show that the potting material with enough large elastic modulus(E>9 GPa) should be optimal selection for high-g accelerometer.