Mechanical modeling of flexible OLED devices |
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Authors: | Chien-Jung Chiang Chris Winscom Steve Bull Andy Monkman |
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Affiliation: | aDepartment of Physics, Durham University, South Road, Durham DH1 3LE, UK;bCentre for Phosphors and Display Materials, The Wolfson Centre for Materials Processing, Brunel University, Uxbridge UB8 3PH, UK;cSchool of Chemical Engineering and Advanced Materials, University of Newcastle Upon Tyne, NE1 7RU, UK |
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Abstract: | General expressions are deduced for the stresses developed in the individual thin layers of a multi-layer structure as a result of bending to a specified radius. These are appropriate for analysing flexible organic light emitting diode (FOLED) devices on flexible substrates. Residual stress (caused internally by temperature change and differential thermal expansion) after material deposition and return to ambient temperatures is not considered. The reduced elastic modulus of the typical small molecule OLED materials: N,N′-bis(naphthalen-1-yl)-N,N′-bis(phenyl)benzidine (NPD) and tris-(8-hydroxyquinoline)aluminum (Alq3) are measured as thin-films using nano-indentation techniques. A conventional device: polyethylene terephthalate (PET)/Buffer layer (BL)/ITO/OLED/Al is considered from a modeling standpoint, as a preliminary to actual fabrication and subsequent comparative testing of OLED performance on rigid and flexible supports. |
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Keywords: | OLED Flexible OLED Elasticity NPD Alq3 |
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