Feature Size Limit of Liftoff Metallization Technology

The feature size limits for liftoff metallization technology are evaluated both experimentally and by computer simulation following Blech's model. The mechanism producing a smoothly sloped metallization pattern profile was also clarified. The simulation reveals that the average slope angle of the metallization pattern sidewalls is determined by the reverse mask topology, metallization thickness, and the maximum incident angle of the evaporation system used for the metallization deposition. Simulation results showed good coincidence with experimental results. It is shown that the average slope angle can be controlled between 20/spl deg/and 70/spl deg/ with polyimide liftoff technology. Feature size limit, i.e., the minimum pitch of metallization patterns, is determined by the reverse mask topology and the maximum incident angle as well as by mechanical and chemical properties of the polyimide layer, but is independent of metallization thickness. In a sample application of the technology in the fabrication of interconnections on rugged LSI surfaces, the minimum pitch of the polyimide liftoff metallization patterns was estirriated to be 2.6 /spl mu/m.