| FBG传感器封装工艺对交叉敏感问题的影响 |
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| 引用本文： | 张文涛,戴静云,孙宝臣. FBG传感器封装工艺对交叉敏感问题的影响[J]. 微纳电子技术, 2007, 0(Z1) |
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| 作者姓名： | 张文涛 戴静云 孙宝臣 |
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| 作者单位： | 河北省大型结构健康诊断与控制重点实验室，河北省大型结构健康诊断与控制重点实验室，河北省大型结构健康诊断与控制重点实验室 石家庄050043，中国科学院半导体研究所集成光电子学国家重点实验室，北京100083，石家庄050043，石家庄050043 |
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| 摘 要： | 研究了光纤光栅(FBG)应变传感器的封装与安装工艺对温度交叉敏感特性的影响。基于弹性力学理论对表面粘贴式和表面螺栓安装式两种典型的FBG应变传感器封装形式的交叉敏感机理进行了理论分析,并对国内几家主要的FBG传感器生产商的产品进行了测试。测试结果表明,表面粘贴式FBG应变传感器的温度交叉敏感性要大于表面安装式FBG应变传感器,与理论分析的结果相符。
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| 关 键 词： | 光纤光栅 应变 温度 交叉敏感 |
Influence of Fabrication and Installation on the Cross Sensitivity of FBG Strain Sensors |
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| ZHANG Wen-tao,,DAI Jing-yun,SUN Baochen. Influence of Fabrication and Installation on the Cross Sensitivity of FBG Strain Sensors[J]. Micronanoelectronic Technology, 2007, 0(Z1) |
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| Authors: | ZHANG Wen-tao DAI Jing-yun SUN Baochen |
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| Affiliation: | ZHANG Wen-tao1,2,DAI Jing-yun1,SUN Baochen1 |
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| Abstract: | The influence of packaging and installation of FBG(fiber brrager grating)strain sensors on the temperature cross sensitivity were studied.Based on the theory of elasticity,the mechanism of the thermal cross sensitivity of two types of FBG strain sensors was analyzed.Experiments were performed using several domestic products.The results show that the stickup-type is more thermal-cross-sensitive than the bolt-mount-type,which is in agreement with the theoretical analysis. |
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| Keywords: | FBG strain temperature cross sensitivity |
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