| 铜薄膜的直流磁控溅射制备与表征 |
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| 引用本文： | 高丽,花银群,陈瑞芳.铜薄膜的直流磁控溅射制备与表征[J].微细加工技术,2008(3). |
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| 作者姓名： | 高丽 花银群 陈瑞芳 |
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| 作者单位： | 1. 江苏大学,材料科学与工程学院,镇江,212013
2. 江苏大学,机械工程学院,镇江,212013 |
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| 摘 要： | 根据薄膜的形成机理,用直流磁控溅射方法制备出了表面结构平滑、致密的Cu薄膜.实验中,采用纯度＞99.9%的铜靶,工作气压保持在2.7 Pa不变,玻璃衬底温度随环境温度变化.用X射线衍射仪(XRD)、扫描电镜(SEM)研究了薄膜的织构、晶粒尺寸和表面形貌.结果表明,随着溅射功率增大,薄膜织构减弱;溅射功率增大和溅射时间增加均可使薄膜的晶粒尺寸增大,在溅射功率≤100 W时获得的薄膜晶粒细小,有裂纹缺陷;溅射功率为150 W,溅射时间为30 min时,薄膜表面结构平滑、致密,晶粒尺寸相对较大.须进一步改进工艺参数,如衬底温度等,从而制备出表面结构平滑、致密、晶粒细小的薄膜.
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| 关 键 词： | Cu薄膜 磁控溅射 织构 |
Preparation and Structure Characterization of Cu Films Deposited on Glass Substrates by D.C.Magnetron Sputtering |
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| GAO Li,HUA Yin-qun,CHEN Rui-fang.Preparation and Structure Characterization of Cu Films Deposited on Glass Substrates by D.C.Magnetron Sputtering[J].Microfabrication Technology,2008(3). |
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| Authors: | GAO Li HUA Yin-qun CHEN Rui-fang |
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| Affiliation: | GAO Li1,HUA Yin-qun1,CHEN Rui-fang2(1.School of Material Science & Engineering,Jiangsu University,Zhenjiang 212013,China,2.School of Mechanical Engineering,China) |
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| Abstract: | Smooth and small grain size copper films are essential for their application.Using D.C.magnetron sputtering,copper films were deposited on glass substrate.The purity of copper target is above 99.9%.During the experiment,workingpressure was kept at 2.7 Pa.The texture,grain size and surface topography of copper films were studied by X-ray diffraction(XRD) and scanning electron microscopy(SEM).The results indicate that the grain size is increased with the increase in sputtering power and time.The XRD results i... |
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| Keywords: | copper films magnetron sputtering texture |
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