| FR-4基材高导热印制板的研制 |
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| 引用本文： | 杨存杰,倪蕴之,彭小波.FR-4基材高导热印制板的研制[J].印制电路信息,2020(2):18-20. |
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| 作者姓名： | 杨存杰 倪蕴之 彭小波 |
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| 作者单位： | 江苏苏杭电子集团公司 |
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| 摘 要： | 介绍一款用FR-4基材,结合导热胶,制作高导热印制电路板的方式。这款印制板既解决了客户要求导热系数高,又成本低廉、可靠性好,还可以代替高成本的金属基印制板。同时在制作方式上,还能利用原来生产设备,生产工艺也可不作大的调整,能够快速导入批量生产。
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| 关 键 词： | FR-4基材 导热胶 高导热印制板 |
Development of high thermal conductivity PCB with FR-4 |
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| Yang Cunjie,Ni Yunzhi,Peng Xiaobo.Development of high thermal conductivity PCB with FR-4[J].Printed Circuit Information,2020(2):18-20. |
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| Authors: | Yang Cunjie Ni Yunzhi Peng Xiaobo |
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| Affiliation: | (Suhang Electronics Co.,Ltd.,Kunshan Jiangsu 215341) |
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| Abstract: | This paper introduces a method of making high heat conduction PCB with FR-4 base material and heat conduction paste.This PCB not only solve the customer's requirement of high thermal conductivity,but also has low cost and good reliability and can replace high cost metal substrate PCB.At the same time,in terms of production mode,the original production equipment shall be used as much as possible,and the production process shall not be greatly adjusted,which can be quickly imported into batch production. |
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| Keywords: | FR-4 Base Material Heat Conductive Paste High Heat Conductive PCB |
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