| 可剥网状铜箔的制作及应用 |
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| 引用本文： | 黄明安,胡小义,温淦尹. 可剥网状铜箔的制作及应用[J]. 印制电路信息, 2020, 0(2): 40-43 |
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| 作者姓名： | 黄明安 胡小义 温淦尹 |
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| 作者单位： | 四会富仕电子科技股份有限公司 |
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| 摘 要： | 文章介绍可剥网状铜箔的制作及应用方法,目的是为实现制作出孔铜厚度大于25μm而表面铜厚度小于25μm的要求,采用的原理及流程是:在表面制作成网状铜层,这网状铜层与底铜在剥离的时候会形成差4倍以上的剥离效果,在电镀的时候起到均匀分布电流的作用,孔内的电镀铜经过烘烤之后产生原子间扩散,与孔壁铜形成牢固的结合力。
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| 关 键 词： | 可剥网状铜层 厚孔铜 薄面铜 原子扩散 |
Production and application of peelable netted copper foil |
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| Huang Mingan,Hu Xiaoyi,Wen Ganyin. Production and application of peelable netted copper foil[J]. Printed Circuit Information, 2020, 0(2): 40-43 |
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| Authors: | Huang Mingan Hu Xiaoyi Wen Ganyin |
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| Abstract: | The article introduced the production and application of peelable netted copper foil.The purpose was to produce hole wall copper thickness more than 25 microns and surface copper thickness less than 25 microns.The principle and process was:made a netted copper foil on the surface,so the the surface netted copper foil could form more than four times the peeling effect from base copper foil because of netted copper foil;This netted copper foil distributed the current evenly during electroplating.The electroplated copper in the hole produced atomic diffusion after baking,formed a firm bond with the copper of the hole wall. |
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| Keywords: | Peelable Netted Copper Thick Hole Copper Thin Surface Copper Atom Diffusion |
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