| 阻焊塞孔流胶问题改善 |
| |
| 引用本文： | 张军杰,肖永龙,李柱强,黎华.阻焊塞孔流胶问题改善[J].印制电路信息,2020(2):21-24. |
| |
| 作者姓名： | 张军杰 肖永龙 李柱强 黎华 |
| |
| 作者单位： | 胜宏科技（惠州）股份有限公司 |
| |
| 摘 要： | 阻焊塞孔技术在PCB行业中是重要的一环。本文主要针对塞孔孔口流胶问题,从设计面、油墨、烤箱、曝光机光源、烤板参数等方面进行验证改善,从而解决了塞孔流胶问题。
|
| 关 键 词： | 阻焊 塞孔 流胶 |
Improvement of solder mask plug hole ink flow |
| |
| Zhang Junjie,Xiao Yonglong,Li Zhuqiang,Li Hua.Improvement of solder mask plug hole ink flow[J].Printed Circuit Information,2020(2):21-24. |
| |
| Authors: | Zhang Junjie Xiao Yonglong Li Zhuqiang Li Hua |
| |
| Abstract: | Solder mask plug hole technology is an important part in PCB industry.In this paper,the problem of plug hole ink flow is verified and improved from different designs,different ink types,different ovens,different exposure machine light sources,different baking parameters and so on,so as to solve the problem of plug hole ink flow. |
| |
| Keywords: | Solder Mask Plug Hole Ink Flow |
| 本文献已被 维普 等数据库收录！ |
|
