3D electroplated microstructures fabricated by a novel height control method |
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| Authors: | L.-W. Pan P. Yuen L. Lin |
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| Affiliation: | (1) Berkeley Sensor and Actuator Center, Mechanical Engineering, The University of Michigan, 1113 Etchevery Hall, Berkeley, CA 94720-1740, USA e-mail: lwpan@me.berkeley.edu, US;(2) Berkeley Sensor and Actuator Center, Mechanical Engineering, University of California at Berkeley, USA, US |
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| Abstract: | A 3D electroplating process by means of pixel-wise, step height control of selective electroplating has been successfully demonstrated. A total of eight rectangular pixels of 80 × 20 μm2 in area and 1.1–9.3 μm in height have been fabricated with a height difference of 1 μm in adjacent pixels. The process requires only two masks in a single electroplating process. Nickel electroplating is selected as the demonstrating material and is performed at 50 °C with current density of 400 A/m2 for 30 min. A theoretical model in electroplating process is discussed to assist the design of 3D microstructures and verified with the experimental data. As such, this process has potential applications in making pixel-wise, 3D microstructures with precise height control. Received: 10 August 2001/Accepted: 24 September 2001 |
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