铜互连CMP工艺中缓蚀剂应用的研究进展*

抛光液是铜互连CMP的关键要素之一，在CMP中每种成分发挥不同的功能，其中缓蚀剂的选择及性能对抛后的表面质量会产生直接影响。对近年来铜互连CMP中各类缓蚀剂的研究进展以及缓蚀剂与不同类型添加剂间的复配协同进行归纳总结，同时介绍缓蚀剂与不同类型添加剂间的作用机制。最后对未来铜互连CMP中缓蚀剂的应用前景进行展望，指出绿色环保的铜互连CMP缓蚀剂的开发，通过缓蚀剂的复配协同作用以提高抛光质量，以及从微观角度进一步揭示缓蚀剂的作用机制是未来的研究方向。

Research Progress on the Application of Corrosion Inhibitors in Copper Interconnection CMP Process

The slurry is one of the key elements of copper interconnection chemical mechanical polishing (CMP),each component plays different functions in the CMP process,while the selection and performance of corrosion inhibitor directly affect the post-polishing surface quality.The research progress of various types of corrosion inhibitors in copper interconnection CMP and the synergy between corrosion inhibitors and different types of additives in recent years was reviewed,the mechanism of action between corrosion inhibitors and different types of additives was introduced.The future prospects for the application of corrosion inhibitors in copper interconnection CMP were presented.It is pointed out that the development of green and environment-friendly CMP inhibitor for copper interconnection,the improvement of polishing quality through the synergistic effect of inhibitor compounding,and the further revelation of the mechanism of inhibitor from the microscopic perspective are the future research directions.