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Electrochemical corrosion behavior of a novel antibacterial stainless steel |
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| Authors: | Yongqian Liu Emeka E Oguzie Ying Li Ke Yang |
| Affiliation: | a Center for Engineering Materials, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Rd., Shenyang 110016, China b State Key Laboratory for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, 62 Wencui Rd., Shenyang 110015, China c Electrochemistry and Materials Science Research Laboratory, Department of Chemistry, Federal University of Technology Owerri, PMB 1526, Owerri, Nigeria |
| Abstract: | A novel antibacterial stainless steel (ASS) with martenstic microstructure has been recently developed, by controlled copper ion implantation, as a new functional material having broad-spectrum antibacterial properties. The electrochemical corrosion behavior of the ASS in 0.05 mol/L NaCl was assessed using linear polarization and electrochemical impedance spectroscopy (EIS) and compared with that of a conventional stainless steel (SS) without copper ion implantation. The ASS exhibited higher corrosion susceptibility in the chloride medium; with a more negative (active) corrosion potential, higher anodic current density and lower charge transfer and polarization resistance. This has been attributed to the occurrence of copper-catalyzed interfacial reactions. A functional tool, 3-D presentation of EIS data, has been employed in analyzing the electrochemical corrosion processes as well as probing complex interfacial phenomena. |
| Keywords: | A Stainless steel A Copper B EIS B Polarization C Corrosion |
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