首页 | 本学科首页   官方微博 | 高级检索  
     


Entwicklung der Konnektivität der Phasen in einer kurzfaserverstärkten Aluminium‐Kolbenlegierung unter Kriechbelastung
Authors:G.C. Requena Dr.  H.P. Degischer  E.D. Marks  E. Boller
Affiliation:1. Institute of Materials Science and Technology, Vienna University of Technology, Karlsplatz 13/308 – A1040 Vienna – Austria;2. European Synchrotron Radiation Facility ‐ Frankreich
Abstract:Developing connectivity of the phases in a short fibre reinforced aluminium piston alloy subjected to creep The evolution of the micro‐structure during creep of an AlSi12CuMgNi piston alloy with 15 vol% of Al2O3 short fibres is investigated by means of synchrotron micro‐tomography. The results reveal a 3D morphology of the rigid phases in the composite: the eutectic‐Si, the short fibres and the Fe‐ and Ni‐rich intermetallic particles, which form an interconnected hybrid reinforcement. The connectivity of these phases increases during creep exposure at 300 °C due to the diffusion induced ripening of Si and of the intermetallic particles. The hybrid reinforcement reaches almost complete percolation after 6400 h of creep exposure. The fibre orientation analysed by three‐dimensional Fast Fourier Transformation does not indicate any reorientation of the fibres along the load direction. The formerly observed strengthening effect during creep exposure is attributed to the increasing load carrying capacity of the interconnected hybrid reinforcement. The analysis of creep damage during secondary creep stage shows the increase of the void volume fraction by a factor of 2 with respect to the void content from processing, while the number of voids per volume remains practically constant. The voids are located at interfaces of the rigid phases and not within the α‐aluminium matrix.
Keywords:Mikro‐Tomografie  kurzfaserverstä  rkte Metalle  Kriechverformung  Hybridverstä  rkung  Porenbildung  micro‐tomography  short fibre reinforced metals  creep  hybrid reinforcement  eutectic Al‐Si  void formation
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号