Straight-sided, buckling-driven delamination of thin films at high stress levels |
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Authors: | Henrik Myhre Jensen Izhak Sheinman |
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Affiliation: | (1) Department of Solid Mechanics, Technical University of Denmark, Building 404, DK-2800 Lyngby, Denmark;(2) Department of Civil Engineering, Technion – Israel Institute of Technology, Haifa, 32000, Israel |
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Abstract: | The fracture mechanics of a straight-sided, thin film delamination at stress levels, which are high compared to the stress required to initiate the delamination is investigated. Buckling at a bifurcation point of the delaminated region, resulting from incompletely relieved stresses in this region, is analysed by a semi- analytical approach for delaminations of infinite extent. The results are compared to numerical predictions based on finite element calculations for finite sized delaminations. The finite element calculations are carried out in the post-buckling regime showing that parts of the crack front will close as a result of bifurcation buckling, while other parts will experience enhanced energy release rate and mode I stress intensity factor. The mode III stress intensity factor is shown to be negligible at the stress levels analysed. |
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Keywords: | Buckling-driven delamination mixed mode interface fracture propagating instabilities thin films. |
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