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Role of structural parameters of ultra-fine grained Cu for its fatigue and crack growth behaviour
Authors:J Horky  G Khatibi  B Weiss  MJ Zehetbauer
Affiliation:1. Department of Mechanical Engineering, Prince Mohammad Bin Fahd University, Al Khobar, Saudi Arabia;2. Department of Mechanical Engineering, Iran University of Science and Technology, Tehran, Iran;3. Department of Mechanical Engineering, University of Maragheh, Maragheh, Iran;1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi''an 710072, China;2. Tsinghua University, Beijing 100084, China;1. University of Konstanz, Department of Physics, 78457 Konstanz, Germany;2. RGS Development B.V., Bijlestaal 54a, 1721 PW Broek op Langedijk, The Netherlands;1. Department of Materials Science and Engineering, Technical University of Cluj-Napoca, 103-105 Muncii Avenue, 400641 Cluj-Napoca, Romania;2. Institut Néel, CNRS, associé à l’Université de Grenoble J. Fourier, 25 rue des Martyrs, BP 166, 38042 Grenoble, France;3. Faculty of Physics, Babes-Bolyai University, 1 M. Kog?lniceanu St., 400084 Cluj-Napoca, Romania;1. School of Materials Science and Engineering, Nanjing Institute of Technology, Nanjing 211167, China;2. Jiangsu Key Laboratory of Advanced Structural Materials and Application Technology, Nanjing 211167, China;3. Insitute of Mechanical Engineering, Yanshan University, Qinhuangdao 066004, China;1. Key Laboratory for Liquid-Solid Structural Evolution & Processing of Materials (Ministry of Education), School of Materials Science and Engineering, Shandong University, Jinan, 250061, PR China;2. College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou, 310018, PR China;3. Jiangsu DeLong Nickel Industry Co., Ltd, Xiangshui, Jiangsu, 224631, PR China
Abstract:High cycle fatigue (HCF) life time curves and fatigue crack growth rates of bulk ultra-fine grained (UFG) copper deformed by high pressure torsion (HPT) were determined. Cu of two different purities as well as a bimodally structured HPT Cu were investigated. The results show increased HCF properties of the UFG materials compared to coarse grained (CG) Cu. Especially HPT Cu with lower purity shows enhanced fatigue resistance due to higher microstructural stability. Contrary, crack growth rates in HPT Cu are increased. In case of the high purity Cu, cyclic deformation induced coarsening of the UFG microstructure nearby the crack is found at threshold crack growth rates leading to a retardation of the fatigue crack propagation. Within these coarse grains typical fatigue surface slip marks as observed in CG Cu are found.
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