电弧离子镀TiFeCrN膜/基复合体的显微硬度研究

用电弧离子镀技术分别在硬质合金、高速钢、紫铜和铝合金这4种基体上沉积TiFeCrN膜，并对这4种膜/基复合体的显微硬度进行了研究。结果表明，Fe与Cr具有提高膜／基复合体显微硬度的作用，其提高的程度与薄膜成分、基体负偏压和基体材质有关。在硬质合金、高速钢(高载荷下)、紫铜3种基体上，随Fe、Cr总的含量的增大，显微硬度升高。在硬质合金、高速钢两种基体上，随负偏压的数值增大，显微硬度下降。在紫铜基体上，显微硬度的相对增量最大。

Microhardness of the TiFeCrN Film-Substrate Composites Obtained by Cathodic Arc Ion Plating

The TiFeCrN and T iN films were deposited on the surface o f YG8 hard metal,W18Cr4V high speed stee l,red copper and LD31 aluminum respectiv ely by cathodic arc ion plating,and the microhardness of these composites was te sted under different loads.The results s how that the added Fe and Cr can enhance d the microhardness of these composites, and the enhanced degree is related with the composition of film,the bias adding to the substrate and the material of sub strate.The microhardness of these compos ites with the substrate of YG8 hard meta l,W18Cr4V high speed steel(under high lo ads)and red copper increases respectivel y with the total contents of Fe and Cr.T he microhardness of the composites with the substrate of YG8 hard metal and W18C r4V high speed steel decreases with the increase of the bias.The relative increm ent of microhardness with the substrate of red copper is the biggest.