化学镀铜溶液中稳定剂与铜沉积速率的关系

研究了化学镀铜溶液中稳定剂对铜沉积速率的影响,着重考虑主配位剂、副反应的抑制剂、甲醛捕获剂对化学镀铜的影响。结果表明,在基本配方8 g/L CuSO4.5H2O,3 g/L HCHO2,8 g/L EDTA7,.5 g/L NaOH,工艺参数pH=12.5,温度50℃,时间40 min的基础上,各种稳定剂的适宜用量为6 mL/L CH3OH、8 mg/L K4Fe(CN)6、6 mg/L 22,’-bipy。在最佳工艺下得到的镀层外观红亮,表面平整,晶粒细致,化学镀铜液稳定。

The relationship between stabilizer and copper deposition rate in the electroless copper plating solution

It was researched for stabilizer on the copper deposition rate in the electroless copper plating solution.It was fully consider for main complexing agent,side effects of inhibitors and formaldehyde capture agent which concentration of electroless copper plating.The base formula as copper sulfate 3 g/L,formaldehyde 8 g/L,ethylenediamine tetraacetic acid 28 g/L,sodium hydroxide 7.5 g/L,the process parameters were temperature being 50℃,the pH value being 12.5 and plating time being 40 min.The amount of the three types of stabilizers were determined for methanol 8 mg/L,potassium ferrocyanide 6 mg/L bipyridyl.The coating obtained under the optimal technical conditions was Hongliang appearance,surface roughness,grain size and detailed electroless copper plating solution stability.