高频高速印制板材料导热性能的研究进展

随着电子技术的发展，对高频高速印制板导热性越来越高的要求。除了开发高成本的高导热性聚合物材料外，在聚合物中填充高导热性的无机材料也是提高高频高速印制板基材导热性能的有效方法，而且填充型复合材料可以用理论模型预测其导热系数。主要综述了填料的形貌、分布与表面改性对填充型复合材料导热系数的影响等方面的研究进展。

Research development on thermal-conductivity materials used in high frequency and high speed printed circuit board

With the development of electronic technology, good performance of thermal conductivity is needed for the printed circuit board （PCB） in high frequency and high speed. Novel polymer materials are developed to obtain high thermal conductivity. However, the methods of filling common polymers with inorganic fillers are effective to improve the thermal conductivity of PCB in low price, compared with high-price and high- thermal-conductivity polymer materials. Thermal conductivity of filled composites could be predicted with theoretical model. The study of thermal-conductivity performance of filled composites is summarized respectively through morphology, distribution and surface modification of inorganic fillers.