| 化学沉镍金速率分析与应用 |
| |
| 引用本文： | 邓涛,罗小明. 化学沉镍金速率分析与应用[J]. 印制电路信息, 2011, 0(12): 52-54,72 |
| |
| 作者姓名： | 邓涛 罗小明 |
| |
| 作者单位： | 株洲南车时代电气股份有限公司印制电路事业部,湖南株洲,412001 |
| |
| 摘 要： | 通过试验分析,得出了温度、pH、浓度与化学镍、化学金析出速率的关系,为精确控制化学镍、化学金的镀层厚度、降低化金成本提供了依据。
|
| 关 键 词： | 化学镍金 沉积速率 分析与应用 |
Analysis and application of ENIG Rate |
| |
| DENG Tao LUO Xiao-ming. Analysis and application of ENIG Rate[J]. Printed Circuit Information, 2011, 0(12): 52-54,72 |
| |
| Authors: | DENG Tao LUO Xiao-ming |
| |
| Affiliation: | DENG Tao LUO Xiao-ming |
| |
| Abstract: | In this paper, experimental analysis shows the relationship between variables （temperature, concentration, pH etc.） and rate of ENIG. Also, this article established a regression model, which could be used to predict the thickness of ENIG and to reduce the cost in practical production. |
| |
| Keywords: | ENIG（electroless nickel and immersion gold） reaction rate analysis and application |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
