| 环氧树脂／氰酸酯／酚醛树脂三元体系在覆铜板中的应用研究 |
| |
| 引用本文： | 汪青. 环氧树脂／氰酸酯／酚醛树脂三元体系在覆铜板中的应用研究[J]. 印制电路信息, 2011, 0(10): 25-26,50 |
| |
| 作者姓名： | 汪青 |
| |
| 作者单位： | 广东生益科技股份有限公司,广东东莞,523039 |
| |
| 摘 要： | 通过红外光谱以及示差扫描量热分析（DSC）等方法分析了环氧树脂／氰酸酯／酚醛树脂三元体系的固化反应过程，并通过该三元体系制作出了具有高耐热性、低介电常数及介质损耗、优异的耐湿热性能及阻燃性、并具有良好加工性能的覆铜板。
|
| 关 键 词： | 环氧树脂 氰酸酯 酚醛树脂 固化反应过程 覆铜板 |
Study on the application of epoxy resin/cyanate ester/novolac resin system in copper clad laminate |
| |
| WANG Qing. Study on the application of epoxy resin/cyanate ester/novolac resin system in copper clad laminate[J]. Printed Circuit Information, 2011, 0(10): 25-26,50 |
| |
| Authors: | WANG Qing |
| |
| Abstract: | The curing process of epoxy resin/cyanate ester/novolac resin system was discussed by FITR and DSC. The copper clad laminate with high heat resistance, low Dielectric Constant and Dissipation Factor, excellent humidity resistance and flame retardance, good processing performance was made through the epoxy resin/cyanate ester/novolac resin system. |
| |
| Keywords: | epoxy resin cyanate ester novolac resin curing process copper clad laminate |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
