| 有机酸改性咪唑环氧树脂固化促进剂的研究 |
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| 引用本文： | 娄春华,孔宪志,朱清梅,马立群.有机酸改性咪唑环氧树脂固化促进剂的研究[J].化学与粘合,2010,32(2):31-34. |
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| 作者姓名： | 娄春华 孔宪志 朱清梅 马立群 |
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| 作者单位： | 娄春华,朱清梅,马立群,LOU Chun-hua,ZHU Qing-mei,MA Li-qun(齐齐哈尔大学高分子材料与工程系,黑龙江,齐齐哈尔,161006);孔宪志,KONG Xian-zhi(黑龙江省科学院石油化学研究院,高分子胶黏剂与功能材料研究中心,黑龙江,哈尔滨,150040) |
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| 摘 要： | 二氰二胺作为环氧树脂的潜伏性固化剂,其固化物机械性能和介电性能优异。但由于二氰二胺与环氧树脂相溶性差,得不到均匀的组成物,且环氧树脂/二氰二胺体系的固化过程需在高于160℃的温度中进行。利用不同含量的有机酸与咪唑3位氮原子中和,改性生成的盐作为环氧树脂/二氰二胺体系固化促进剂,对该体系进行了改进,使其能够在中温(90～120℃)条件下固化。利用IR对改性产物进行了表征,并对未加促进剂的环氧树脂/双氰胺体系和以咪唑及有机酸改性咪唑为促进剂三种体系分别进行了差热分析。结果表明,有机酸改性咪唑促进剂可以使环氧树脂/二氰二胺体系的固化温度降低近50℃,并且适用期显著增加,长达141d,耐水性和耐热老化性能增加。
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| 关 键 词： | 环氧树脂 二氰二胺 有机酸 改性咪唑 促进剂 中温固化 |
Study on a Curing Accelerator for Epoxy Resin: Modified Imidazole by Organic Acid |
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| LOU Chun-hua,KONG Xian-zhi,ZHU Qing-mei,MA Li-qun.Study on a Curing Accelerator for Epoxy Resin: Modified Imidazole by Organic Acid[J].Chemistry and Adhesion,2010,32(2):31-34. |
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| Authors: | LOU Chun-hua KONG Xian-zhi ZHU Qing-mei MA Li-qun |
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| Affiliation: | 1. Department of Polymer Material and Engineering, Qiqihar University, Qiqihar 161006, China; 2. Institute of Petrochemistry,Heilongjiang A c ode my of Science, Harb in 150040, China) |
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| Abstract: | Dicyandiamide is a kind of latent curing agents for epoxy,whose cured product has excellent mechanical properties and electrical performances. However homogeneous composite can not be obtained because of the poor compatibility between dicyandiamide and epoxy. And the curing temperature for epoxy resin system which cured by dicyandiamide is over 160℃ A kind of Imidazole-salt is synthesized with using different contents organic acid and imidazole, and it is used as curing accelerator for the epoxy resin/dicyandiamide system and made them can cure at moderate temperature （90-120℃）. The modified product is characterized by IR and DSC. The results show that the curing temperature of the modified imidazole system decreased about 50℃, and the storage time of the adhesive prolongs to 141 days, and the moisture resistance and heat resistance are improved. |
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| Keywords: | Epoxy resin dicyandiamide organic acid modified imidazole accelerator moderate temperature curing |
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