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Physical modeling of hole mobility in silicon inversion layers under uniaxial stress
Authors:Ji Zhao  Yaohua Tan  Jianping Zou  Zhiping Yu
Affiliation:(1) Institute of Microelectronics, Tsinghua University, Beijing, 100084, China
Abstract:A physical model for hole mobility under either biaxial or uniaxial stress has been developed. The six-band k ? p theory is used to obtain the bandstructure through stress-dependent Hamiltonian. The hole mobility in the silicon inversion layer is studied in details using Monte Carlo method. A numerically robust method has been applied to achieve self-consistent solution of Poisson’s and Schrödinger equations.
Keywords:k    p   Hole mobility  Uniaxial stress
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