| 铜表面硫化膜形成及其电接触特性 |
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| 引用本文： | 杨光,章继高,鲍春燕. 铜表面硫化膜形成及其电接触特性[J]. 电子工艺技术, 1999, 20(3): 120-122 |
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| 作者姓名： | 杨光 章继高 鲍春燕 |
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| 作者单位： | 1. 北京邮电大学,100876
2. 太钢设计院,太原,030009 |
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| 摘 要： | 用库仑分析法测定了在湿热含Ｈ２Ｏ气氛中铜表面腐蚀膜层的厚度及其随腐蚀时间的变化，对不同Ｈ２Ｓ浓度的膜层变化曲线存在的差异进行了探讨。分析了膜层厚度变化对电接触性能的影响及其异常现蟓 。
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| 关 键 词： | 铜腐蚀膜 库仑分析法 电接触 |
| 修稿时间： | 1999-01-18 |
Research on Sulphuret Films of Forming on Copper Surface and the Electrical Contact Propertise |
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| Yang Guang,Zhang Jigao,Bao Chunyan. Research on Sulphuret Films of Forming on Copper Surface and the Electrical Contact Propertise[J]. Electronics Process Technology, 1999, 20(3): 120-122 |
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| Authors: | Yang Guang Zhang Jigao Bao Chunyan |
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| Abstract: | The thickness of corrosion films on copper electric contact surface,which formed in moisture heat atmosphere including H 2S gas,is determined by coulometry.The thickness changes along with corrosion time are protracted.The difference of film variety curve in two H 2S densities is researched.The AES analysis shows that coulometry was used correctly in our experiment condition.The effect of film thickness variety on electric contact property as wel as its special phenomena is analyzed. |
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| Keywords: | Copper corrosion film Coulometry Electrical contact |
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