| 无卤化FR-4覆铜板开发进展 |
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| 引用本文： | 祝大同. 无卤化FR-4覆铜板开发进展[J]. 绝缘材料, 2002, 35(4): 30-33,36 |
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| 作者姓名： | 祝大同 |
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| 作者单位： | 北京绝缘材料厂,北京,100054 |
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| 摘 要： | 论文对近年来日本在无卤化FR-4覆铜板开发思路及具体工艺路线作了深入的探讨。
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| 关 键 词： | 无卤化FR－4覆铜板 绝缘材料 环氧树脂 阻燃剂 PCB板 |
| 文章编号： | 1009-9239(2002)04-0030-05 |
Development of non-halogen flame retardent FR-4 copper clad laminates |
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| Zhu Da tong. Development of non-halogen flame retardent FR-4 copper clad laminates[J]. Insulating Materials, 2002, 35(4): 30-33,36 |
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| Authors: | Zhu Da tong |
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| Abstract: | This paper reviews the technological progess in non halogen flame retardent FR 4 copper clad laminates recently in Japan,focuses on phosphoric epoxy resin and nitrogenous epoxy resin and other similar flame retardent addtives. |
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| Keywords: | copper clad laminate FR 4 flame retardent non halogen |
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