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| 采用底部填料预涂工艺的Au-Sn粘结倒芯片COF技术 | |
| 引用本文： | 蔡积庆.采用底部填料预涂工艺的Au-Sn粘结倒芯片COF技术[J].印制电路信息,2004,20(10):60-64. |
| 作者姓名： | 蔡积庆 |
| 摘 要： | 概述了COF粘结技术以及应用底部填料预涂工艺的Au-Sn粘结倒芯片COF技术。 |
| 关 键 词： | COF粘结技术 底部填料树脂预涂工艺 挠性板 Au-Sn低共熔晶体合金 |
Au-Sn Bonding Flip Chip COF Technology Using Pre Applied Underfill Process |
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| Cai Jiqing.Au-Sn Bonding Flip Chip COF Technology Using Pre Applied Underfill Process[J].Printed Circuit Information,2004,20(10):60-64. | |
| Authors: | Cai Jiqing |
| Abstract: | This paper summarizes bonding process for COF and Au-Sn bonding flip chip COF technology using pre-applied underfill process. |
| Keywords: | COF bonding technology pre-applied underfill resin process flexible printed circuit (FPC) Au-Sn eutectic alloy |
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