| 封接用钼箔带材表面质量研究 |
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| 引用本文： | 吴晓惠,左羽飞.封接用钼箔带材表面质量研究[J].中国钼业,2003,27(2):51-52. |
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| 作者姓名： | 吴晓惠 左羽飞 |
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| 作者单位： | 金堆城钼业公司技术中心,西安,710068 |
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| 摘 要： | 主要阐述电子行业中电真空管、电气密管 ,用封接材料钼翼形带腐蚀前后粗糙度的变化 ,及其对封接性能的影响。经过电腐蚀钼翼形带的粗糙度增加 ,边部粗糙度小于中部。稀土钼带的粗糙度大于纯钼带的粗糙度。翼形带表面粗糙度对封接性能有很大的影响
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| 关 键 词： | 表面 封接 粗糙度 |
| 文章编号： | 1006-2602(2003)02-0051-02 |
| 修稿时间： | 2003年1月21日 |
STUDY ON SURFACE QUALITY OF MOLYBDENUM RIBBON FOR SEALING |
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| Wu Xiaohui,Zuo Yufei.STUDY ON SURFACE QUALITY OF MOLYBDENUM RIBBON FOR SEALING[J].China Molybdenum Industry,2003,27(2):51-52. |
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| Authors: | Wu Xiaohui Zuo Yufei |
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| Abstract: | The article expounds granulation degree changing of molybdenum foil and ribbon suitable for electrical leads sealed into quarts vacuum tube and seale tube,and the effect of sealed performance. Granulation degree of molybdenum foil and ribbon by electroanalysis increases. The granulation degree of side is bigger than middle. The granulation degree of ODS-Mo Foil and Ribbon is bigger than pure molybdenum foil and ribbon. The surface granulation degree more influenced sealed performance. |
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| Keywords: | Surface Sealed Granulation degree |
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