| 雷达用多层微波综合背板制造工艺研究 |
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| 引用本文： | 杨维生.雷达用多层微波综合背板制造工艺研究[J].现代雷达,2011,33(10):77-80. |
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| 作者姓名： | 杨维生 |
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| 作者单位： | 南京电子技术研究所,南京,210039 |
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| 摘 要： | 对多种型号雷达用多层微波综合背板材料CLTE-XT进行了性能及特点介绍。创新性运用埋置膜电阻技术、金属化孔制造的反钻孔技术,实现了多层微波综合背板的制造。并对其制造过程中所涉及的层间定位、多层化制造、孔金属化实现等关键技术进行了详细阐述,对此类微波多层背板的制造具有指导意义。
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| 关 键 词： | 雷达 多层微波综合背板 制造工艺 |
A Study on Processing Technology of the Compositive Microwave Multilayer Printed Circuit Board for Radar |
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| YANG Wei-sheng.A Study on Processing Technology of the Compositive Microwave Multilayer Printed Circuit Board for Radar[J].Modern Radar,2011,33(10):77-80. |
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| Authors: | YANG Wei-sheng |
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| Affiliation: | YANG Wei-sheng(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China) |
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| Abstract: | The CLTE-XT microwave laminates,which applied to many kinds of radar was briefly introduced about the properties and benefits in this paper.Besides,using the technology of the planar buried isolating resistor and the processing technology of the controlled drilled of the multilayer printed circuited board,the compositive microwave multilayer printed circuit board was successfully manufactured.Finally,the registration and the press key technologies of the radar used compositive multilayer microwave printed c... |
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| Keywords: | radar compositive microwave printed circuit board processing technology |
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