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Ag包复WC,C粉末触头材料的组织与性能
引用本文:李玉桐,李建设. Ag包复WC,C粉末触头材料的组织与性能[J]. 材料研究学报, 1995, 9(5): 399-402
作者姓名:李玉桐  李建设
作者单位:天津大学
摘    要:用化学镀在WC,C粉末表面包复了一层Ag,改善了不同粉末间的浸润性,增强了颗粒间结合强度,使Ag-WC-C系触头材料中各相分布均匀,性能提高。

关 键 词:触头材料 包复粉末 金属基 复合材料 电阻率
收稿时间:1995-10-25
修稿时间:1995-10-25

MICROSTRUCTURE AND PROPERTIES OF ELECTRICAL CONTACT MATERIALS OF WC, CPOWDER COATED WITH Ag
Li Yutong,Li Jianshe. MICROSTRUCTURE AND PROPERTIES OF ELECTRICAL CONTACT MATERIALS OF WC, CPOWDER COATED WITH Ag[J]. Chinese Journal of Materials Research, 1995, 9(5): 399-402
Authors:Li Yutong  Li Jianshe
Affiliation:Tianjin University
Abstract:A chemical plating method was used to coat WC and C powder with Ag. The experimental results shown that this method could improve the infiltration between WC, C and Ag powders and make phases distributed evenly. The electrical contact materials, which were made by silver plate powders, have some advantages in electrical contact materials, which were made by mechanical mixing powders. Such as: the resistivity decrease to 80-82%, the bending strength increase by a factor of 1.8, the contact resistance is lower, the experimental results of contact test at 30A, 105 cycle is stable and the property of anti-fusion welding is better.
Keywords:electrical contact materical powder coated by Ag  
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