| 软钎焊料漫流性的研究 |
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| 引用本文： | 伍光凤,蒙永云,黄虹.软钎焊料漫流性的研究[J].热加工工艺,2003(6):39-40. |
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| 作者姓名： | 伍光凤 蒙永云 黄虹 |
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| 作者单位： | 重庆工学院,重庆,400050 |
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| 摘 要： | 对多种锡铅焊料进行一系列不同条件下的漫流性试验，分析它们在铜表面上的铺展状况，最后归纳出焊料成分、钎焊温度、助焊剂对软钎焊料漫流性影响的规律。
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| 关 键 词： | 软钎焊 锡铅焊料 助焊剂 漫流性 |
| 文章编号： | 1001-3814(2003)06-0039-02 |
| 修稿时间： | 2003年7月14日 |
Study of Flowing Property on Filler Metals of Solder |
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| WU Guang-feng,MENG Yong-yun,HUANG hong.Study of Flowing Property on Filler Metals of Solder[J].Hot Working Technology,2003(6):39-40. |
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| Authors: | WU Guang-feng MENG Yong-yun HUANG hong |
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| Abstract: | A series of flowing property tests on Tin-lead solders were down,and their spreading on the copper surface was analyzed.An influence of solder compositions, soldering temperature,flux on solder's flowing property of has been concluded. |
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| Keywords: | soldering tin-lead solder flux flowing property |
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