钼酸铵浓度对玻璃基片化学机械抛光的影响

为了满足先进电子产品对玻璃母盘基片的表面超光滑的要求，氧化硅基抛光液平坦性能的重要性日益凸显，但它的致命缺点是抛光速率较低。本文采用胶体氧化硅为磨料，钼酸铵为抛光速率促进剂，研究了其浓度对玻璃基片材料去除率、抛光后表面粗糙度和抛光过程中摩擦系数的影响。结果表明，当钼酸铵浓度为2%时，可以达到最高的材料去除率和最低的表面粗糙度。另外，在线摩擦系数测试表明材料去除率和摩擦系数成正比。

Effect of ammonium molybdate concentration on chemical mechanical polishing of glass substrate

The effect of the ammonium molybdate concentration on the material removal rate (MRR) and surface quality in the preliminary chemical mechanical polishing (CMP) of a rough glass substrate was investigated using a silica-based slurry. Experimental results reveal that the ammonium molybdate concentration has a strong influence on the CMP behaviors of glass substrates. When the ammonium molybdate was added to the baseline slurry, polishing rates increased, and then decreased with a transition at 2 wt.%, and the root mean square (RMS) roughness decreased with increasing ammonium molybdate concentration up to 2 wt.%, after which it increased linearly up to 4 wt.%. The improvement in MRR and RMS roughness may be attributed to the complexation of hydrolysis products of the glass substrate with the ammonium molybdate so as to prevent their redeposition onto the substrate surface. It was found that there exists an optimal ammonium molybdate concentration at 2 wt.% for obtaining the highest MRR and the lowest RMS roughness within a particular polishing time.