| 新型无铅焊料合金Sn-Ag-Cu-In-Bi的研究 |
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| 引用本文： | 陈国海,耿志挺,马莒生,张岳. 新型无铅焊料合金Sn-Ag-Cu-In-Bi的研究[J]. 电子元件与材料, 2003, 22(4): 36-38 |
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| 作者姓名： | 陈国海 耿志挺 马莒生 张岳 |
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| 作者单位： | 清华大学材料科学与工程系,北京,100084 |
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| 摘 要： | 目前广泛用于电子工业界的Sn-Pb焊料合金由于Pb的毒性而将被限制使用,无铅焊料合金的研制成为研究的热点。笔者以Sn-Ag-Cu合金为母合金,同时添加In和Bi元素,得到了性能更好的无铅焊料合金,进行了一系列的性能测试,包括熔点、硬度、剪切强度以及可焊性。并且确定了综合性能较好的焊料的成分范围。
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| 关 键 词： | 无铅焊料 Sn-Ag-Cu-In-Bi 熔点 熔程 剪切强度 铺展率 浸润角 |
| 文章编号： | 1001-2028(2003)04-0036-03 |
A New Type Lead-free Solder |
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| CHEN Guo-hai,GENG Zhi-ting,MA Ju-sheng,ZHANG Yue. A New Type Lead-free Solder[J]. Electronic Components & Materials, 2003, 22(4): 36-38 |
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| Authors: | CHEN Guo-hai GENG Zhi-ting MA Ju-sheng ZHANG Yue |
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| Abstract: | The Sn-Pb solder commonly used in electronic industry will be restricted because of the leads toxicity. The study on lead-free solder is becoming a focus. The new solder is an alloy of Sn-Ag-Cu-In-Bi, which exhibit better performance. By a series of properties tests related with melting point, hardness, shear strength, solderability, etc., a optimum formula for Sn-Ag-Cu-In-Bi lead-free solder has been determined. |
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| Keywords: | lead-free solder Sn-Ag-Cu-In-Bi melting point melting range shear strength coverage wetting angle |
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