| 无铅焊接工艺中常见缺陷及防止措施 |
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| 引用本文： | 史建卫. 无铅焊接工艺中常见缺陷及防止措施[J]. 电子工艺技术, 2008, 29(2): 116-119 |
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| 作者姓名： | 史建卫 |
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| 作者单位： | 日东电子科技(深圳)有限公司,广东,深圳,518103 |
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| 摘 要： | 无铅化电子组装中,由于原材料的变化带来一系列工艺的变化,随之产生许多新的焊接缺陷.针对焊点剥离和元素污染缺陷进行了产生机理分析,并给出了相应的解决措施.
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| 关 键 词： | 无铅 焊点 缺陷 剥离 元素污染 |
| 文章编号： | 1001-3474(2008)02-0116-04 |
| 修稿时间： | 2008-01-10 |
Solder Defects and Solutions in Lead-free Soldering Technology |
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| SHI Jian-wei. Solder Defects and Solutions in Lead-free Soldering Technology[J]. Electronics Process Technology, 2008, 29(2): 116-119 |
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| Authors: | SHI Jian-wei |
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| Affiliation: | SHI Jian-wei(Sun East Electronic Technology Company Lt.d,Shenzhen 518103,China) |
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| Abstract: | Changes of material bring a series of process problems in lead-free electronic assembly with occurrence of new solder defects.Analyze causes and give solution of solder defects for lift-off and element contamination. |
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| Keywords: | Lead-free Solder joint Defect Lift-off Element contamination |
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