Ti90及其优化合金的组织与力学性能研究

研究了钎焊与时效过程中,在Sn0.7Ag0.5Cu(SAC0705)钎料与Cu基板和石墨烯Cu基板界面处金属间化合物(IMC)的形成与演变。采用加热平台制备焊接试样并在120℃时效600h。结果表明,界面金属间化合物在时效过程中增厚。SAC0705/Cu和SAC0705/G-Cu 2种焊接界面金属间化合物均为Cu6Sn5。当钎料中添加Ni元素后,Cu6Sn5化合物转变为(Cu,Ni)6Sn5。随着钎料中Ni元素含量的增大,2种基板上的界面金属间化合物厚度先增加后减小。此外,随着Ni含量增大,化合物生长速率降低。石墨烯Cu基板表面的石墨烯层起到扩散阻挡层效果,因此,石墨烯Cu板上的化合物厚度小于常规Cu基板,同时其界面化合物生长速率较低。

Microstructure and Mechanical Properties of Ti90 and Optimized Alloy

This paper investigated the formation and the growth of intermetallic compound (IMC) layer at the interface between Sn0.7Ag0.5Cu (SAC0705) solder and Cu or graphene-coated Cu (G-Cu) substrates during soldering and aging. The samples were soldered on a heating platform by aging treatment at 120 °C for up to 600 h. The experimental results showed that the thickness of IMC increased with the increasing aging time. The Cu6Sn5 IMC layer was observed between SAC0705/Cu and SAC0705/G-Cu interfaces. As the addition of Ni element in the solder, Cu6Sn5 transform into (Cu, Ni)6Sn5. With the increase of Ni content, the thickness of IMC showed an increase trend first and then decreased on the two kinds of substrates. Moreover, as the Ni content adds, the growth rate constant of interfacial IMC layer decreased. Since the graphene layer works as a diffusion barrier, the IMC on G-Cu is thinner than that on Cu substrate. And the growth rate constant of the interfacial IMC on G-Cu substrate is lower than that on Cu substrate.