| 环氧树脂/有机脲体系的固化反应动力学 |
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| 引用本文： | 高菁菁,张晓雅,朱康,王炳强,蔡计杰,孙昊,孙莺,胡和丰. 环氧树脂/有机脲体系的固化反应动力学[J]. 合成树脂及塑料, 2020, 37(3): 11-14,18. DOI: 10.19825/j.issn.1002-1396.2020.03.03 |
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| 作者姓名： | 高菁菁 张晓雅 朱康 王炳强 蔡计杰 孙昊 孙莺 胡和丰 |
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| 作者单位： | 上海大学材料科学与工程学院,上海市 200444,上海大学材料科学与工程学院,上海市 200444,上海大学材料科学与工程学院,上海市 200444,上海大学材料科学与工程学院,上海市 200444,上海晋飞碳纤科技股份有限公司,上海市 201306,上海晋飞碳纤科技股份有限公司,上海市 201306,上海大学材料科学与工程学院,上海市 200444,上海大学材料科学与工程学院,上海市 200444 |
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| 摘 要： | 研究了环氧树脂/有机脲体系的固化行为,探讨了固化反应机理。结果表明:有机脲是一种能有效固化环氧树脂的潜伏性固化剂;固化反应机理为有机脲与环氧树脂首先反应生成噁唑酮和仲胺,在环氧树脂过量的情况下,仲胺与环氧树脂反应生成叔胺,叔胺进一步反应产生阴离子活性中心,最终引发阴离子开环聚合。反应初期固化反应速率受有机脲分解产生仲胺浓度的影响,反应中期有机脲分解完毕,阴离子活性中心浓度为常数。
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| 关 键 词： | 环氧树脂 有机脲 固化反应动力学 差示扫描量热法 |
Curing kinetics of epoxy resin/organic urea system |
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| Gao Jingjing,Zhang Xiaoya,Zhu Kang,Wang Bingqiang,Cai Jijie,Sun Hao,Sun Ying,Hu Hefeng. Curing kinetics of epoxy resin/organic urea system[J]. China Synthetic Resin and Plastics, 2020, 37(3): 11-14,18. DOI: 10.19825/j.issn.1002-1396.2020.03.03 |
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| Authors: | Gao Jingjing Zhang Xiaoya Zhu Kang Wang Bingqiang Cai Jijie Sun Hao Sun Ying Hu Hefeng |
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| Affiliation: | (School of Materials Science and Engineering,Shanghai University,Shanghai 200444,China;Shanghai Cedar Composites Technology Co.,Ltd.,Shanghai 201306,China) |
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| Abstract: | The curing behavior of epoxy resin/organic urea system was observed to explore the mechanism of curing reaction.The results show that organic urea is an effective latent curing agent for epoxy resin.The anion ring-opening polymerization of epoxy is initiated by the tertiary amine formed by the rapid reaction of epoxy resin and secondary amine released by the reaction of organic urea and epoxy resin in excessive content.The initial curing rate is affected by the concentration of dimethylamine produced by the decomposition of organic urea.At the middle stage of reaction,organic urea decomposition is completed,and the concentration of anion active center is constant. |
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| Keywords: | epoxy resin organic urea curing kinetics differential scanning calorimetry |
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