Thermomechanical deformation imaging of power devices by electronic speckle pattern interferometry (ESPI) |
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Authors: | K. Nassim L. Joannes A. CornetS. Dilhaire E. Schaub W. Claeys |
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Abstract: | We present an original imaging method to measure the three components of the surface displacement of working power devices with a nanometric resolution. The method takes advantage of the speckle structure of the analysed object recorded on a CCD camera. This method is complementary of IR thermography and provides interesting information concerning stress and reliability in power devices. |
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