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Electrochemical analysis of zincate treatments for Al and Al alloy films |
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| Authors: | Mikiko Saito Takeyuki Maegawa |
| Affiliation: | a Nanotechnology Research Laboratory, Waseda University, Waseda Tsurumakicho, Shinjuku, Tokyo 162-0041, Japan b Advanced Technology R&D Center, Mitsubishi Electric Corp., Sagamihara, Kanagawa 229-1195, Japan c Department of Applied Chemistry, Waseda University, Okubo, Shinjuku, Tokyo 169-8555, Japan |
| Abstract: | Electrochemical behavior of Al and Al alloy films in zincate solution was investigated to elucidate the effect of the zincate pretreatment for electroless NiP deposition, which is used for under bump metallization for LSI interconnects. The immersion potential for AlCu and AlSiCu, immediately reached to constant, which was almost equal potential to zinc reference electrode. The corrosion current for the AlCu and AlSiCu films was larger than that of the Al and AlSi films in the zincate solution. It was also confirmed that the deposited Zn at the surface of AlCu and AlSiCu films possessed smaller grain size and larger amount of nucleation, resulted in the formation of flat NiP films. |
| Keywords: | Al alloy films Under bump metallization Zincate treatment Immersion potential |
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