Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications |
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| Authors: | Norihiro Togasaki Takayuki Homma Tetsuya Osaka |
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| Affiliation: | a Department of Applied Chemistry, Waseda University, Okubo, Shinjuku, Tokyo 169-8555, Japan
b Advanced Research Institute for Science and Engineering, Waseda University, Okubo, Shinjuku, Tokyo 169-8555, Japan |
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| Abstract: | A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material. |
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| Keywords: | Amorphous gold-nickel alloy Nickel-tungsten alloy Hardness Resistivity Contact resistance |
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