Pre-cracking technique for fracture mechanics experiments along interface between thin film and substrate |
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Authors: | Hiroyuki Hirakata Takayuki Kitamura |
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Affiliation: | a Department of Engineering Physics and Mechanics, Kyoto University, Kyoto 606-8501, Japan b Hitachi Home and Life Solutions, Inc., Tochigi 329-4493, Japan |
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Abstract: | Utilizing the difference in interface strength due to fabrication process, a technique for producing a sharp pre-crack between a thin film and a substrate is proposed. A cracked specimen for examining fracture toughness of interface between a sputtered copper (Cu) thin film and silicon (Si) is made by the method. A vacuum-evaporated Cu thin film, which has poor adhesion to Si, is inserted between the sputtered Cu thin film and the Si substrate as a release layer. The release layer debonds from the Si substrate at very low load, and the sharp pre-crack is successfully introduced along the interface. Using the pre-cracked specimen, the interface fracture toughness test is conducted and the critical J-integral, JC, is evaluated as about 1 J/m2 for the sputtered Cu/Si interface. |
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Keywords: | Thin film Interface Fracture toughness Interface crack Pre-crack Copper film Fracture mechanics Material testing |
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