A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications |
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Authors: | Y C Lin Jue Zhong |
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Affiliation: | (1) School of Mechanical and Electrical Engineering, Central South University, Lushan South Road, Changsha, Hunan Province, 410083, P.R. China |
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Abstract: | New interconnect materials are always necessary as a result of evolving packaging technologies and increasing performance
and environmental demands on electronic systems. Polymer-based conductive-adhesive materials have become widely used in many
electronic packaging interconnect applications. Among all the conductive-adhesive materials, the anisotropic conductive adhesives
(ACA) (or anisotropic conductive adhesive films, ACF) have gained popularity as a potential replacement for solder interconnects.
The interest in using ACA instead of solder comes partly from the fact that the use of ACA for the direct interconnection
of flipped silicon chips to printed circuits (flip chip packaging) offers numerous advantages such as reduced thickness, improved
environmental compatibility, lowered assembly process temperature, increased metallization options, reduced cost, and decreased
equipment needs. In this review, a summary of our understanding of the electrical, physical, thermal, chemical, environmental,
and cost behaviors of ACA in conjunction with various packaging applications is elaborated. First, the formulation and curing
kinetics of ACA materials, as well as the conduction mechanisms of ACA joints, are introduced; second, the influencing factors,
including the boding process (boding temperature, boding pressure, curing conditions, reflow and misalignment processes, etc),
the environmental factors (temperature, humidity, impact load, etc), and the properties of the components (the properties
of the ACA, substrates, conductive particles, the bump height, etc), on the reliability of ACA joining technology are presented.
Finally, future research areas and remaining issues are pointed out. The purpose is simply to pinpoint the most important
papers that have played significant role for the advancement of the ACA bonding technology. |
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