| MEMS封装技术及设备 |
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| 引用本文： | 童志义. MEMS封装技术及设备[J]. 电子工业专用设备, 2010, 39(9): 1-8 |
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| 作者姓名： | 童志义 |
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| 作者单位： | 中国电子科技集团公司第四十五研究所,北京,065201 |
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| 摘 要： | 概述了进入后摩尔时代的MEMS技术,通过TSV技术整合MEMS与CMOS制程,使得半导体与MEMS产业的发展由于技术的整合而出现新的商机。主要介绍了MEMS器件封装所面临的挑战及相应的封装设备。
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| 关 键 词： | MEMS封装技术 MEMS封装设备 晶圆片键合机 低温晶圆键合机 倒装芯片键合机 |
MEMS Packaging Technology and Equipment |
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| TONG Zhiyi. MEMS Packaging Technology and Equipment[J]. Equipment for Electronic Products Marufacturing, 2010, 39(9): 1-8 |
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| Authors: | TONG Zhiyi |
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| Affiliation: | TONG Zhiyi(The 45th Research Institute of CETC,Beijing 065201,China) |
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| Abstract: | This paper overviews the MEMS technology of More than Moore era,through the integration of MEMS and CMOS technology with TSV process,making the emergence of business opportunities that development of semiconductor and MEMS industry based on the integration of technology.and introduces mainly the facing challenges of MEMS device package and its corresponding packaging equipment. |
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| Keywords: | MEMS packaging technology MEMS packaging equipment Wafer Bonding bonder low temperature wafer bonding bonder flip-chip bonder |
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