| 含氮杂环二胺固化双酚F环氧胶粘剂的研究 |
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| 引用本文： | 王锦艳,栾国栋,宋蕾,蹇锡高.含氮杂环二胺固化双酚F环氧胶粘剂的研究[J].热固性树脂,2012(4):51-54. |
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| 作者姓名： | 王锦艳 栾国栋 宋蕾 蹇锡高 |
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| 作者单位： | 辽宁省高性能树脂工程技术研究中心;大连理工大学化工学院高分子材料系; |
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| 摘 要： | 以1,2-二氢-2-(4-氨基苯基)-4-4-(4-氨基苯氧基)-苯基]-二氮杂萘-1-酮(DHPZ-DA)为固化剂,采用示差扫描量热法(DSC),TGA,红外光谱及剪切强度测试研究了双酚F环氧树脂/DHPZ-DA粘接体系固化行为及耐热性。由Kissinger和Ozawa方法计算得到固化体系的表观活化能分别为80.1 kJ/mol和84.3kJ/mol。由Crane方程求得的表观反应级数为0.93。该胶粘剂体系Tg>200℃,当双酚F环氧树脂与DHPZ-DA固化剂的物质的量比为10∶4时,其室温剪切强度与150℃老化24 h后的剪切强度均大于12 MPa,表现出良好的耐热性。
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| 关 键 词： | 二氮杂萘酮 双酚F环氧树脂 固化剂 胶粘剂 固化反应动力学 耐热性 剪切强度 |
Study on bisphenol F epoxy adhesive using DHPZ-DA as curing agent |
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| WANG Jin-yan,LUAN Guo-dong,SONG Lei,JIAN Xi-gao.Study on bisphenol F epoxy adhesive using DHPZ-DA as curing agent[J].Thermosetting Resin,2012(4):51-54. |
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| Authors: | WANG Jin-yan LUAN Guo-dong SONG Lei JIAN Xi-gao |
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| Affiliation: | (Liaoning High-Performance Resin Engineering Technology Institute Center,Department of Polymer Science & Materi-als,Dalian University of Technology,Dalian 116024,China) |
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| Abstract: | The curing behaviors and heat resistance of bisphenol F epoxy resin/DHPZ-DA bonding system using 1,2-dihydro-2-(4-aminophenyl)-4-4-(4-aminophenoxyl)phenyl]-phthalazin-1-one(DHPZ-DA) as curing agent were investigated by DSC,TGA,infrared spectroscopy and shear strength testsing.The curing apparent activation energy were 80.1 kJ/mol and 84.3 kJ/mol calculated by the Kissinger and Ozawa methods,respectively.The apparent reaction order obtained by the Crane equation was 0.93.The Tg of the adhesive system was higher than 200 ℃.The shear strength at room temperature and after aging at 150 ℃ for 24 h of the system with molar ratio of bisphenol F epoxy resin to DHPZ-DA 10∶ 4 were greater than 12MPa and showed good heat resistance. |
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| Keywords: | phthalazinone ketone bisphenol F epoxy resin curing agent adhesive curing reaction kinetics heat resistance shear strength |
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