| 铜及铜合金化学抛光及钝化的研究 |
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| 引用本文： | 郭贤烙,肖鑫,易翔,钟萍. 铜及铜合金化学抛光及钝化的研究[J]. 表面技术, 2001, 30(2): 35-36,39 |
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| 作者姓名： | 郭贤烙 肖鑫 易翔 钟萍 |
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| 作者单位： | 湖南工程学院,湖南,湘潭,411101 |
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| 摘 要： | 研究了铜及铜合金化学抛光液及其钝化液的组成和工艺，讨论了抛光液各组分和抛光温度、时间、搅拌方式等工艺条件的影响，介绍了一种铜及铜合金的化学抛光和钝化工艺。
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| 关 键 词： | 铜合金 铜 化学抛光 钝化 |
| 文章编号： | 1001-3660(2001)02-0013-03 |
Study on Chemical Polishing and Passivation of Copper and Copper Alloy |
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| GUO Xian luo,XIAO Xin,YI Xiang,ZHONG Ping. Study on Chemical Polishing and Passivation of Copper and Copper Alloy[J]. Surface Technology, 2001, 30(2): 35-36,39 |
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| Authors: | GUO Xian luo XIAO Xin YI Xiang ZHONG Ping |
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| Abstract: | Chemical polishing solution and passivation sloution of copper and copper alloy were studied.The effects of various component of the solution and technological parameters including polishing temperature,polishing time and the mode of agitation etc are discussed.In this paper,a new process of copper and copper alloy chemical polishing and passivation is introduced. |
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| Keywords: | Copper and copper alloy Chemical polishing Passivation |
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