Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints

Accelerated thermal cycling (ATC) has been widely used in the microelectronics industry for reliability assessment. ATC testing decreases life cycle test time by one or more of the following means: increasing the heating and cooling rate, decreasing the hold time, or increasing the range of the applied temperature. The relative effect of each of these cycle parameters and the failure mechanisms they induce has been the subject of many studies; however uncertainty remains, particularly regarding the role of the heating and cooling rate. In this research, three conditions with two ramp rates (14 °C/min and 95 °C/min) and two temperature ranges (ΔT = 0–100 °C and −40 to 125 °C) were applied to resistor 2512 and PBGA 256 test vehicles assembled with SnPb and Pb-free solders. The test results showed that the higher ramp rate reduced the testing time while retaining the same failure modes, and that the damage per cycle increased with the temperature difference. For the resistors, the Pb-free solder joints lasted longer than the SnPb joints at the smaller ΔT, but were inferior at the larger ΔT. In contrast, the Pb-free solder joints in the PBGA test vehicles lasted longer than the SnPb solder under both conditions.