| 基于ANSYS Workbench的电子封装QFP热分析 |
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| 引用本文： | 袁金鹏,贾育秦,曾志迎,闵学习. 基于ANSYS Workbench的电子封装QFP热分析[J]. 机械工程与自动化, 2012, 0(3): 152-153 |
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| 作者姓名： | 袁金鹏 贾育秦 曾志迎 闵学习 |
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| 作者单位： | 太原科技大学,山西太原,030024 |
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| 摘 要： | 电子产品在工作过程中会产生大量的热,可靠的热分析在电子产品设计中必不可少.运用ANSYSWorkbench对电子封装QFP结构进行热分析,得到电子封装系统的温度云图,并提出了提高QFP散热率的方法.
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| 关 键 词： | 热分析 ANSYS Workbench QFP |
QFP Thermal Analysis Based on ANSYS Workbench |
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| YUAN Jin-peng , JIA Yu-qin , ZENG Zhi-ying , MIN Xue-xi. QFP Thermal Analysis Based on ANSYS Workbench[J]. Mechanical Engineering & Automation, 2012, 0(3): 152-153 |
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| Authors: | YUAN Jin-peng JIA Yu-qin ZENG Zhi-ying MIN Xue-xi |
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| Affiliation: | (Taiyuan University of Science and Technology,Taiyuan 030024,China) |
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| Abstract: | Electronic products will produce a lot of heat during work.The reliable thermal analysis is necessary in electronic product design.In this paper,a thermal analysis of electronic packaging QFP was carried out by use of ANSYS Workbench,the temperature cloud chart was gained.And some ways to improve the heat dissipating rate of QFP were proposed. |
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| Keywords: | thermal analysis ANSYS Workbench QFP |
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