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稳定剂对化学镀镍液及镀层性能的影响
引用本文:刘海萍,李宁,毕四富.稳定剂对化学镀镍液及镀层性能的影响[J].电镀与环保,2006,26(2):20-23.
作者姓名:刘海萍  李宁  毕四富
作者单位:哈尔滨工业大学,应用化学系,黑龙江哈尔滨,150001
摘    要:在前期确定的基础化学镀镍液配方基础上,分别添加KI、苯骈三氮唑、含硫有机杂环化合物A等稳定剂,考察了其对镀液的稳定性能、镀速、镀层性能等影响.优选了一种不仅能使镀液稳定性能良好,而且镀层耐蚀性能优异的药品A作为化学镀镍液的稳定剂.研究表明,合适的稳定剂在不改变镀层中磷含量的基础上,不但可以提高镀液的稳定性,同时还可获得高耐蚀性镀层.

关 键 词:印刷线路板  化学镀镍  稳定剂  稳定性  耐蚀性
文章编号:1000-4742(2006)02-0020-03
收稿时间:2005-09-23
修稿时间:2005年9月23日

Effects of Stabilizers on the Stability of Electroless Nickel Bath and the Deposit Performance
LIU Hai-ping,LI Ning,BI Si-fu.Effects of Stabilizers on the Stability of Electroless Nickel Bath and the Deposit Performance[J].Electroplating & Pollution Control,2006,26(2):20-23.
Authors:LIU Hai-ping  LI Ning  BI Si-fu
Affiliation:Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001
Abstract:To the basic electroless nickel bath compositions confirmed in our previous work,three electroless nickel bath stabilizers of KI,benzotriazole and organic heterocyclic compounds A containing sulfur are added respectively,and the stabilizing effects of these three stabilizers on electroless nickel bath are inevstigated.A is chosen as an excellent electroless nickel bath stabilizer,which can not only stabilize the bath very well but also bring an excellent corrosinon resistance to the coatings.The research results show that an appropriate stabilizer can improve both the stability of the bath and the corrosion resistance of the deposit without changing the P content in the deposit.
Keywords:PCB(printed circuit board)  electroless nickel plating  stabilizer  stability  nitric acid corrosion resistance
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