Effect of grain boundaries on isothermal solidification during transient liquid phase brazing |
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Authors: | H Kokawa C H Lee T H North |
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Affiliation: | (1) Department of Materials Processing, Tohoku University, 980 Sendai, Japan;(2) Research Institute of Industrial Science and Technology, 790-600 Pohang, South Korea;(3) Department of Metallurgy and Materials Science, University of Toronto, M5S 1A4 Toronto, ON, Canada |
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Abstract: | The influence of liquid penetration at grain boundary regions on the rate of advance of the solid-liquid interface during
isothermal solidification of transient liquid phase (TLP) brazed nickel joints has been examined. The test samples used in
this study were Ohno-cast nickel with a grain size of >4 mm and a fine-grained nickel with a grain size of around 40 μm. Both
Ni-base materials had the same chemical composition. The rate of isothermal solidification was greater when fine-grained nickel
was employed during TLP brazing using Ni-11 wt pct P filler metal at 1200 °C. Liquid penetration at grain boundaries accelerates
the isothermal solidification process by increasing the effective solid-liquid interfacial area and increasing the rate of
solute diffusion into the base material. An analysis of electron channeling patterns has confirmed that random high-angle
boundaries have a greater influence on the rate of isothermal solidification than ordered boundaries including small-angle
or twin boundaries.
Formerly Visiting Scientist, Department of Metallurgy and Materials Science, University of Toronto.
Formerly Postdoctoral Fellow, Department of Metallurgy and Materials Science, University of Toronto |
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