| 挠性覆铜板用电解铜箔 |
| |
| 引用本文： | 蔡积庆. 挠性覆铜板用电解铜箔[J]. 印制电路信息, 2007, 7(12): 42-47,54 |
| |
| 作者姓名： | 蔡积庆 |
| |
| 作者单位： | 江苏南京,210018 |
| |
| 摘 要： | 概述了电解铜箔"U-WZ箔"和"DFF箔"的开发和特性,它们适用于COF用途等挠性覆铜板的铜箔。
|
| 关 键 词： | 挠性覆铜板 电解铜箔 |
| 文章编号： | 1009-0096(2007)12-0042-06 |
The Electrolytic Copper Foil for Flexible Clad-copper Laminates |
| |
| Cai Jiqing. The Electrolytic Copper Foil for Flexible Clad-copper Laminates[J]. Printed Circuit Information, 2007, 7(12): 42-47,54 |
| |
| Authors: | Cai Jiqing |
| |
| Abstract: | This paper describes the development and characteristics of the electrolytic copper foil "V-W2 foil"and "DFF", They are suitable to copper foil of flexible clad-copper laminate for COF etc. application. |
| |
| Keywords: | COF |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
